Prealigners

Logosol’s time-tested technology and high standard for reliability are the foundation of the most extensive line of prealigners in the industry. The Prealigners product family supports the handling of objects from 45mm to 480mm with any level of transparency, from opaque to fully transparent. Logosol’s unique all-in-one design and versatile control software enable drop-in compatibility and interface with a variety of semiconductor platforms.

Standalone

Autonomous devices for high-accuracy alignment of 45mm – 480mm objects, including square and dual-layer substrates, featuring single-unit handling of objects of multiple sizes without mechanical repositioning, chuck-load and pin-load modes, and high precision options.

Embedded

Cost-effective center calculation and angular orientation devices for high speed wafer transfer systems featuring alignment capability for objects 45mm – 480mm and easy integration with any market-available robot. High precision and chuck size/material options available.

Edge Handling

Innovative autonomous devices featuring Passive Edge Contact with zero gripping force, Logosol’s alternative to edge-gripping prealigner technology that ensures no wafer stress and maximum cleanliness for handling of objects 75mm – 300mm. Standard and high precision models.

Fast Swap

High-throughput prealigners featuring Fast Swap functionality based on a proprietary design which allows for wafer chuck loading below the pin level.

Custom

The foundation of Logosol’s extensive prealigner product family is a technology that we have designed and developed every aspect of in-house, from silicon and mechanical design, to motion control and software. This vertical integration, along with our 30 years of experience developing numerous prealigners for a wide variety of applications enables us to offer solutions to customers whose specifications are not met by our standard models.